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PREPARED BY:
DATE: /?7' ZJ-dtx /t6 ELECTRONIC COMPONENTS GROUP SHARP CORPORATION s PEC~CATION
T. cleda
1 Opto-Electronic Devices Division
DEVICE SPECIFICATION
FOR
Light Emitting Diode
MODEL No.
I
1
GL6ZJ27
I
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers L If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Rescue and security equipment * Traffic signals * Gas leakage sensor breakers * Other safety equipment c (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) C * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: MKatoh, Department General Manager of Engineering Dept.,IH Ooto-Electronic Devices Division Eiectronic Components Group SHARP CORPORATION
1
1
1
CUSTOMER'S
APPROVAL.
DATE:
BY:
DG996048 MODEL No.
Jun/16/99
PAGE
GL6Zl27
l/10
_
GL6ZT27 Snecification
1. Application This specificationapplies the light emitting diode deviceModel No. GL6ZJ27. to [AlGalnP (dicing or scribe/braketype) Grange LED device]
2. Outline dimensions pin connections. . . . . . . . . . . . . . . . . . . . . . .. . . . .Refer to the attachedsheetPage2. and
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . ..*................ 3-1. Absolute maximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram
Refer to the attachedsheetPage3-4.
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............ 4- 1. Test itemsand testconditions 4-2. Measurement itemsandFailure judgement criteria
Refer to the attachedsheetPage5.
Refer to the attachedsheetPage6. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*......... 5-1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria and classificaof defect 54. Test itemsthe surfaceis be applied for flat type, judgement criteria andclassificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............... 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environnient
Refer to the attachedsheetPage7-8.
7. Precautions use. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. for 7- 1. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions .7-4. For cleaning
IX996048
MODEL No.
Jun/16/99
PAGE
2 ~the
dimensions and pin
COMeCtionS
Colorless
transparency
I
2. 54 OM
i
Pin coMections 0. Anode 0. cathode
iote) Unspecified tol. to be +0&m rote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Fiih Lead : Sn plated or wave soldering Drawing No. 51106029
DG996048 MODEL No. GL6ZJ27
Junl16l99 PAGE 3110
3. Ratings and characteristics \
(Note 1) Duty ratb=l/lO,Pulse tidth=O. lms (Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification. 3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 5 e 100
01
I
I
I
795I
I 100
1 125
-25
0
Ambient
25
50
1585100 Ta?C)
125
-25
0
Ambient
25
50
Temperature
Temperature
Ta("C)
DG996048 MODEL No.
.Jun/16/99 PAGE 4110
GL6ZJ27
Peak
Forward
Current
vs. Duty Ratio (Ta=25%)
l/100
l/10 Duty Raito
1
10
DR (Note 11
3-4. Characteristics
Forward
Diagram(typ)
Current
vs.Forward
Voltage (Ta=25"C)
1000
Relative Luminous intensity vs. Ambient Temperature
( I F=2OmA)
s .t E 2 o.f E 5 2 e .?fl z
100
O.l"!"'Ir""""' 1
J
1.2 1.4 Forward 1.6 1.8 Voltage
Intensity vs.
10
2
2.2 VFW)
Froward
2.4
2.6
-60 -40 -20
Ambient
0
20 40 60 80 100 120
Ta(OC)-
Temprature
Relative
Luminous
Voltage
(Ta=25"C) 1000
:: .2 2
Oh .E E
100
10
2
5 -J 2 .+ 2 d
1
0. 1
0.01 0. 1 Forward 1 Current 10 IFW) 100
(Note
l)Above
characteristicdataaretypicaldata
andnotagumtteeddata.
DG996048
MODEL No.
Jun/16/99
PAGE
GL6ZJ27
5/10
4. Reliability The reliability of productsshallbe satisfiedwith itemslisted below. t-1. Test itemsandtestconditions Test items Solderability Soldering temperature Mechanicalshock Variabie frequency vibration Terminalstrength (Tension) Terminal strength (Bending) Temperature cycling High temp*andhigh humidity storage Test conditions Confidencelevel: 904 Samples (n) LTPD Defective (Cl (%) n=ll. C=O n=ll, C=O n=ll, C=O n=ll, c=O n=ll, C=O n=ll, C=O n=22, C=O n=22, C=O 20 20 20 20
23Or+5'=C. 5s
Prior disposition: Dip in rosin flux
26025C.
5s
15 OOOm/s*, 0.5ms, 3tirnes/ S,fY,iZ direction 2Olh/s*, 100 to 2 000 to lOOH&weep for 4min. ,4times/&iY ,Ez direction Weight:lON. Ss/each terminal Weight:SN, 0" -90" /each terminai -+ OQ -90" -+ 0" cycles
20
20 10 10 10 10 10
-40~(3Omin)~+l~"c(3~in),30 Ta=+60"C, 9O%RH,t=lOOOh
tigh temperature storage Ta=lOO"c, t=lOOOh ow temperature storageTa=-40=, t=lOOOh Operationlife Ta=25"C, IrMAX, t=lOOOh*3
n=22,c=-O
n=22, C=O n=22, C=O
4-2. Measurement itemsandFailurejudgementcriteria * 1 Measurement Forward voltage Reversecurrent J.mninous intensity QIllbOl
vF
Failurejudgementcriteria *2
v,>u.s.L.x I,>u.s.L.x
1.2 2.0
IR
IV
Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
s Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. Z Terminal strength: Packageis not destroyed,and terminal is not slack. *l: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby Upper Specification Limit. *3: lr MAX.is shownby forward current of absolute maximumratings.
DG996048
MODEL No.
I Jun/16/9!
1 PAGE
I
5. Incoming inspection 5-l. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling phn,normal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4%
GL62J27
6110
classifica of defer
Exceed 9 0.3mm or O.lmm x 1. 9 10 11 12 13 Void Uneven density of material for scattering Unbalanced center BUlT Insertion position of terminal Exceed @0.3mm (on top view) Extremely uneven density Exceed M.25mm from package center Exceed +0.2mm againstprovided dimension Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defect Minor defect
DG996048 MODEL No.
.Tunll61W
PAGE
I
GL6Z27
I
7110
6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs same the luminousintensity rank productsinto pack andput following labelby pack. Product weight: 0.28g (One Prodwt,Typ.) (Indication labelsample) SHIPMENT TABLE PART No. GL6ZJ27 + Mcdel number *cl cl 00000 250 - Quantity of products QUANXTY KA99B19 * Lot number* LOT No. -5-G 0 0 0
O-0 tLuminous
+ Production
intensity rank
country
SHARP'
AfADE IN JAPAN
dominantwavelengthrank
0 @ @ @ @
Productionplantccxie(to be indicatedalphabetically) Support code Year of prcduction(thelast two figures of the year) Month of production (to be indicatedalphabeticallywith Januarycorresponding A) to Date of production(Ol-31)
6-l-2. Outer package Put 8 packs (the same luminousintensity rank) into outer package. (approximately670gper one outer package) 6-l-3. Outer package line dimension out Width: 14Omm.Depth: 225mm. Hight: 90mm
(Note 1) Tolerance:flS% In regardto luminousintensity , the following ranking shallbe carriedout. However the quantity of eachrank shallnot be pre scribed. In case the distributionof the luminousintensity shift to high, at that of point new upperrank is prescribedand lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Dominantwavelength Rank 617.0 T 613.5 U 616.0 619.5 622.0 V 618.5 W 624.5 621.0 627.0 X 623.5 (Ta=25"C) Condition
Unit
nm
IF2OmA
(Note 2) The conditionof measurementThe measurement the light emissionfrom the front sideof lamp. : of This rank value is the settingvalue of when that classifies the rank andbe not a guaranteevalue. it Also I shallnot ask the delivery ratio of eachrank.
.
DO996048 MODELNo.
I
GL6ZJ27
Junl16/99 PAGE 1 8/10
64. Environment 6-4-l. ozOnosphere destructive chemicals. (1) The &vice doesn't contain following substance. (2) The &vice doesn't have a production line whose processnquires following substance. Restricted part: CFCsJlalones,CCb,Trichloroethane(Methych) I 642. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
DG996048
MODEL No.
I Jud16/99
( PAGE
GL6ZJ27
7. Precautions
g/10
for use
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be forsed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LED lamp on a PW.do not apply physical stress to the lead pins. *The lead pin pitch should match the PllB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Bhen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 !Yhenan LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PVE$the base of the lead pins may be subjected to physical stress due to PWB warp,cutting or clinching of lead pins. Prior to' use, be sure to check that no disconnection inside of the resin or damageto resin etc.,is found.Yhen an LED lamp is mounted on a double-sided PTBthe heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the PWB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the ins ide of resin to any undue stress.
l
- y)&+FJJp-
c
d~cn
formint
NG
Good
0
I
!. 6mm
c
I
Do48
JunhY99
PAGE
lo/lo
MODELNo.
GL6ZJ27
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295C*S"c. within 3 seconds 1. Manual soldering 260Ck 5C. within 5 seconds 2. Wave soldering Preheating 70C to 8OC, within 30 seconds 3. Auto soldering S oldering 245Cf YC, within 5 seconds (Note) Avoid dinning resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LEDlamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection mayoccur.
i ton
7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,Pm size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent -is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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